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    PRODUCT

    Technology Overview

     

     The Ceramic Substrate Microstrip Filter (CSMF) is a high-performance RF and microwave filter implemented on a precision ceramic substrate using microstrip resonator technology.

     Various dielectric ceramic materials with dielectric constants (εr) of 3, 5, 9, 15, 20, 37, 60, and 90 are available to optimize electrical performance, size, and thermal stability.

     The ceramic substrate is manufactured through a proprietary process consisting of powder preparation, forming, sintering, lapping, precision polishing, metallization, and semiconductor-grade patterning technologies.

     Material selection is optimized according to the required center frequency, bandwidth, insertion loss, temperature coefficient, power handling capability, and package size.

     

     

    Operating Principle

     

     CSMF operates in a Quasi-TEM (Quasi-Transverse Electromagnetic) mode, providing excellent phase linearity and extremely low group delay variation.

     The superior group delay performance makes CSMF highly suitable for advanced communication systems, satellite payloads, radar systems, beamforming networks, and phased-array antennas where signal integrity is critical.

     

     

    Manufacturing Technology

     

    Ceramic Processing

     - Dielectric Powder Preparation
     - Precision Press Forming
     - High Temperature Sintering
     - Lapping Process
     - Precision Surface Polishing

     

    Metallization & Patterning Technology

     

    3 GHz to 40 GHz

     For microwave frequency applications, the filter is fabricated using:

     - Precision Silver Metallization
     - Silver Firing Process
     - Pico-Second UV Laser Patterning
     - High Accuracy Electrode Formation

     

    Above 40 GHz

     For millimeter-wave applications, semiconductor manufacturing technology is utilized, including:

     - Lift-Off Process
     - Thin-Film Metallization
     - Photolithography
     - Ultra-Fine Pattern Formation

     This process enables extremely accurate conductor geometry and superior electrical performance at millimeter-wave frequencies.

     

     

     

    Surface Roughness Control

     

     Conductor loss becomes increasingly critical at higher frequencies. Therefore, precision polishing processes are applied to minimize surface roughness before metallization.

     The optimized surface finish significantly improves conductor quality, reduces insertion loss, and enhances overall filter Q-factor.

     

     

     

    Key Specifications

     

     - Parameter| Specification
     - Frequency Range| 3 GHz ~ 40 GHz
     - Extended Frequency Range| Above 40 GHz Available
     - Dielectric Constant (εr)| 3, 5, 9, 15, 20, 37, 60, 90
     - Operating Mode| Quasi-TEM
     - Temperature Coefficient (TCF)| 3 ~ 30 ppm/°C
     - Metallization| Ag, Au, Thin-Film
     - Patterning Technology| Pico-Second UV Laser & Semiconductor Process
     - Surface Finish| Precision Polished Ceramic
     - Impedance| 50 Ω

     

     

     

    Key Features

     

    Wide Frequency Coverage

     Supports RF, microwave, and millimeter-wave applications.

    Low Group Delay Variation

     Excellent phase linearity for advanced communication systems.

    High-Q Ceramic Materials

     Optimized dielectric materials for low insertion loss and high selectivity.

    Precision Manufacturing

     Combines ceramic processing, laser patterning, and semiconductor fabrication technologies.

    Excellent Temperature Stability

     TCF values as low as 3 ppm/°C depending on material selection.

    Compact and Lightweight

     High dielectric constant materials enable significant size reduction.

     

     

     

    Applications

     

     - Satellite Communication Systems
     - Electronically Steered Antennas (ESA)
     - Beamforming Networks
     - Phased Array Radar Systems
     - Aerospace Communication Equipment
     - Defense Electronics
     - 5G / 6G Infrastructure
     - RF Test & Measurement Equipment
     - Microwave and Millimeter-Wave Systems

     

     

     

    Core Competencies

     

     Our integrated manufacturing capability covers the complete process from ceramic material formulation to final RF filter production.

     - Ceramic Material Development
     - Powder Processing
     - Press Forming & Sintering
     - Precision Lapping & Polishing
     - Silver Metallization
     - Pico-Second UV Laser Patterning
     - Semiconductor Lift-Off Technology
     - RF Design & Characterization

     This vertically integrated manufacturing platform enables rapid development of custom RF and microwave filter solutions for commercial, aerospace, satellite, and defense applications.

     
    {"google":["Barlow","Montserrat"],"custom":["Noto Sans KR"]}{"google":["Barlow","Montserrat"],"custom":["Noto Sans KR"]}
    {"google":["Barlow"],"custom":["Noto Sans KR"]}