PRODUCT
Technology Overview
The Ceramic Substrate Microstrip Filter (CSMF) is a high-performance RF and microwave filter implemented on a precision ceramic substrate using microstrip resonator technology.
Various dielectric ceramic materials with dielectric constants (εr) of 3, 5, 9, 15, 20, 37, 60, and 90 are available to optimize electrical performance, size, and thermal stability.
The ceramic substrate is manufactured through a proprietary process consisting of powder preparation, forming, sintering, lapping, precision polishing, metallization, and semiconductor-grade patterning technologies.
Material selection is optimized according to the required center frequency, bandwidth, insertion loss, temperature coefficient, power handling capability, and package size.
Operating Principle
CSMF operates in a Quasi-TEM (Quasi-Transverse Electromagnetic) mode, providing excellent phase linearity and extremely low group delay variation.
The superior group delay performance makes CSMF highly suitable for advanced communication systems, satellite payloads, radar systems, beamforming networks, and phased-array antennas where signal integrity is critical.
Manufacturing Technology
Ceramic Processing
- Dielectric Powder Preparation
- Precision Press Forming
- High Temperature Sintering
- Lapping Process
- Precision Surface Polishing
Metallization & Patterning Technology
3 GHz to 40 GHz
For microwave frequency applications, the filter is fabricated using:
- Precision Silver Metallization
- Silver Firing Process
- Pico-Second UV Laser Patterning
- High Accuracy Electrode Formation
Above 40 GHz
For millimeter-wave applications, semiconductor manufacturing technology is utilized, including:
- Lift-Off Process
- Thin-Film Metallization
- Photolithography
- Ultra-Fine Pattern Formation
This process enables extremely accurate conductor geometry and superior electrical performance at millimeter-wave frequencies.
Surface Roughness Control
Conductor loss becomes increasingly critical at higher frequencies. Therefore, precision polishing processes are applied to minimize surface roughness before metallization.
The optimized surface finish significantly improves conductor quality, reduces insertion loss, and enhances overall filter Q-factor.
Key Specifications
- Parameter| Specification
- Frequency Range| 3 GHz ~ 40 GHz
- Extended Frequency Range| Above 40 GHz Available
- Dielectric Constant (εr)| 3, 5, 9, 15, 20, 37, 60, 90
- Operating Mode| Quasi-TEM
- Temperature Coefficient (TCF)| 3 ~ 30 ppm/°C
- Metallization| Ag, Au, Thin-Film
- Patterning Technology| Pico-Second UV Laser & Semiconductor Process
- Surface Finish| Precision Polished Ceramic
- Impedance| 50 Ω
Key Features
Wide Frequency Coverage
Supports RF, microwave, and millimeter-wave applications.
Low Group Delay Variation
Excellent phase linearity for advanced communication systems.
High-Q Ceramic Materials
Optimized dielectric materials for low insertion loss and high selectivity.
Precision Manufacturing
Combines ceramic processing, laser patterning, and semiconductor fabrication technologies.
Excellent Temperature Stability
TCF values as low as 3 ppm/°C depending on material selection.
Compact and Lightweight
High dielectric constant materials enable significant size reduction.
Applications
- Satellite Communication Systems
- Electronically Steered Antennas (ESA)
- Beamforming Networks
- Phased Array Radar Systems
- Aerospace Communication Equipment
- Defense Electronics
- 5G / 6G Infrastructure
- RF Test & Measurement Equipment
- Microwave and Millimeter-Wave Systems
Core Competencies
Our integrated manufacturing capability covers the complete process from ceramic material formulation to final RF filter production.
- Ceramic Material Development
- Powder Processing
- Press Forming & Sintering
- Precision Lapping & Polishing
- Silver Metallization
- Pico-Second UV Laser Patterning
- Semiconductor Lift-Off Technology
- RF Design & Characterization
This vertically integrated manufacturing platform enables rapid development of custom RF and microwave filter solutions for commercial, aerospace, satellite, and defense applications.


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